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PRECISION. THERMAL. JOINING

We develop cooling solutions

At a Glance

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Employees
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Years Experience
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m² Production Space

What can we do for you?

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Coating Technology

Functional coatings and metallization for optics and electronics, tailored for demanding environments.

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Laser Components

Precision-packaged laser and photonic components with robust joining and thermal management.

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Server/IT Cooling

Scalable liquid and hybrid cooling solutions for high-density servers and data-center infrastructure.

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Heatsinks

Custom high-performance heatsinks engineered for maximum thermal conductivity and long-term reliability.

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CAD, Design

From concept to production-ready CAD—design for performance, manufacturability, and integration.

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Thermal Simulation

Fast, validated thermal simulations to predict performance, optimize designs, and reduce prototyping cycles.

PHOTONICPARTS

Through our brand PHOTONICPARTS, founded in 2023, we further specialize in the integration and assembly of photonic components, delivering precision-engineered solutions to meet the most demanding requirements. Major fields of application are the packaging, adjustment and thermal management of laser crystals, optics and fibre optics in the markets of laser technology, aerospace and quantum technologies. 
 
We offer:
- laser gain media packaging
- non-linear crystal packaging
- design and assembly of photonic components and sub-systems
- faraday rotators and isolators
- active solder alignment technology 
- metallization and coating services
 
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CORECOOLING

Through our brand CORECOOLING, we develop advanced Direct-to-Chip liquid cooling solutions for high-performance electronics, AI systems and HPC infrastructure. By combining thermal design, flow optimization, joining technologies and manufacturing in-house, we deliver customized cooling systems with low thermal resistance and high integration flexibility.
 
We offer:
- customized Direct-to-Chip cooling solutions
- CPU and GPU liquid coolers
- thermal and fluidic system design
- high-temperature liquid cooling
- heat-reuse concepts
- in-house manufacturing and joining technologies
 
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Our Company

XCCES GmbH is a technology company based in Herzogenrath, Germany, specializing in advanced thermal management and joining solutions for high-performance applications. With a modern 1,000 m² facility for production, development, and office space, and a growing team of 14 employees, we combine cutting-edge engineering with scalable manufacturing capabilities.
 
Our expertise covers highly reliable, thermally stable solder joints and customized packaging solutions for diverse industries—including laser technology, photonics, quantum technologies, aerospace, and defense. With advanced processes such as flux-free vacuum soldering, we achieve minimal thermal and electrical resistance, enabling long-term stability and outstanding performance of components.
 
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